Detailed terms for PCB assembly
Technical requirement
1. Professional surface-mounting and through-hole soldering technology
2. Various sizes like 1206, 0805, 0603 components SMT technology
3. ICT (In Circuit Test), FCT (Functional Circuit Test) technology
4. PCB assembly with UL, CE, FCC, RoHS approval
5. Nitrogen gas reflow soldering technology for SMT
6. High standard SMT and solder assembly line
Quote requirement
1. Gerber file and Bom list
2. Clear pics of pcba or pcba sample for us
3. Test method for PCBA
Jingxin advantages
- ISO9001: 2008 certificates
- UL and ROHS certificates
- PCBA free function test
- PCBA with 2 years warranty
- 16 years producing experience
- 20 SMT lines and 4 Thru-hole lines
- 600 workers
94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
SMT process (RoHs Compliant) Capabilities up to:
1. 0402 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils
THT(Wave soldering) process (RoHs Compliant) Capabilities up to:
| SERIAL | ITEM | TECHNICAL DATA |
| 1 | Product Name | |
| 2 | Brand | Jingxin |
| 3 | Layers | 1-28(layers) |
| 4 | Max Board Size | 457 x 610mm |
| 5 | Min Board Thickness | 4(layers)0.60mm/24mil |
| 6(layers)0.80mm/32mil |
| 8(layers)1.00mm/40mil |
| 10(layers)1.20mm/48mil |
| 6 | Min Line Width | 0.10mm /4mil |
| 7 | Min Line Space | 0.10mm /4mil |
| 8 | Min Hole Size | 0.20mm /8mil |
| 9 | PTH Wall Thickness | 0.020mm /0.8mil |
| 10 | PTH dia tolerance | ±0.05mm /±2mil |
| 11 | NPTH hole dia tolerance | ±0.025mm /±1mil |
| 12 | Hole Position Deviation | ±0.05mm /±2mil |
| 13 | Qutline Tolerance | ±0.1mm /±4mil |
| 14 | S/M Pitch | 0.08mm /3mil |
| 15 | Insulation Resistance | 1E + 12Ω (Normal) |
| 16 | Aspect ratio | 10:1 |
| 17 | Thermal shock | 288℃(10 seconds 3 times)/3x10Sec@288℃ |
| 18 | Warp and Twist | ≤0.7% |
| 19 | Electric Strength | >1.3KV/mm |
| 20 | Peel Strength | 1.4N/MM |
| 21 | Solder Mask Abrasion | ≥6H |
| 22 | Flammability | 94V-0 |
| 23 | Impedance Control | ±5% |
All of the above description is to demonstrate the ability of our factory, if you
have specific requirements,please contact us.
